Category Archives: Soc

Qualcomm Tech Summit, Day 3: Snapdragon 8cx, the New ACPC SoC

For the final day of Qualcomm’s 3rd Annual Tech Summit, the focus is on its Always Connected PC (ACPC) platform. This is Qualcomm’s attempt to bring mobile processors to standard laptops by enabling Windows on Snapdragon devices. So far we have seen two generations of processors, both based on the preceding mobile chip for flexibility. Now Qualcomm has announced that the ACPC market will get its own dedicated chip, called the Snapdragon 8cx. Here’s what we know.

Qualcomm Tech Summit, Day 3: Snapdragon 8cx, the New ACPC SoC

For the final day of Qualcomm’s 3rd Annual Tech Summit, the focus is on its Always Connected PC (ACPC) platform. This is Qualcomm’s attempt to bring mobile processors to standard laptops by enabling Windows on Snapdragon devices. So far we have seen two generations of processors, both based on the preceding mobile chip for flexibility. Now Qualcomm has announced that the ACPC market will get its own dedicated chip, called the Snapdragon 8cx. Here’s what we know.

Qualcomm Tech Summit, Day 3: Snapdragon 8cx, the New ACPC SoC

For the final day of Qualcomm’s 3rd Annual Tech Summit, the focus is on its Always Connected PC (ACPC) platform. This is Qualcomm’s attempt to bring mobile processors to standard laptops by enabling Windows on Snapdragon devices. So far we have seen two generations of processors, both based on the preceding mobile chip for flexibility. Now Qualcomm has announced that the ACPC market will get its own dedicated chip, called the Snapdragon 8cx. Here’s what we know.

Arm TechCon 2018 Keynote Live Blog (Starts at 1pm ET)

We're here at the San Jose Convention Center for Arm's annual developer conference and tech showcase, TechCon. Arm of course needs no introduction, and while the company is an IP provider rather than a hardware manufacturer, the net result is that they have their finger in everything from servers to embedded devices. Which has presented the company with a lot of growth opportunities, but also no shortage of competition as everyone works to grab a piece of these markets.

IFA 2018: Huawei Kirin 980 Keynote Live Blog

Our big keynote of the IFA 2018 show is from Huawei, with CEO Richard Yu set to take the stage and detail the newest Kirin 980 chipset for us. There's no livestream, so sit back and read as the information flows in.

Huawei To Announce Kirin 980 Today at IFA

In the smartphone wars, the chip inside powering the devices is becoming ever more important. Raw performance plus accelerators are pushing the boundaries of what we used to think was possible. Huawei’s unique selling point is that it designs its own chips for its smartphones, based a lot on Arm’s reference cores. Today, Huawei will be announcing its next generation SoC to the world.

As proudly declared on stage at the Honor launch event yesterday, with Honor’s own upcoming Magic 2 smartphone having it inside, Honor’s CEO George Zhao proudly declared that Richard Yu, CEO of Huawei CBG, will be announcing the Kirin 980 today.

Huawei’s current flagship SoC is the Kirin 970, which sits inside the Mate 10, P20, P20 Pro, and Honor’s Play, Honor 10, and Honor View 10. All of Huawei’s chips are made by their internal design house, HiSilicon, and the Kirin 970 was announced last year at IFA, so it makes sense that this year we would see the next generation, the Kirin 980, around this time.

Huawei has a long tradition of being a primary Arm partner, often using its latest design options where possible to get the edge of the competition. The Kirin 980, as with the silicon before it, aims for the highest echelons of performance in order to set it apart from the competition. You can also expect the Kirin 980 to be promoted alongside Huawei’s other ‘features’, such as GPU Turbo.

As for the internals of the Kirin 980, Huawei rarely disappoints on this front, but everyone will have to stay tuned for the official announcement to see just what's in store for their new SoC.

HiSilicon High-End Kirin SoC Lineup
SoC Kirin 980 Kirin 970 Kirin 960
CPU POWER* 4x A73 @ 2.36 GHz
4x A53 @ 1.84 GHz
4x A73 @ 2.36GHz
4x A53 @ 1.84GHz
GPU TURBO* ARM Mali-G72MP12
746 MHz
ARM Mali-G71MP8
1037MHz
LPDDR4
Memory
SOME* 4x 16-bit CH
LPDDR4 @ 1833 MHz
29.9GB/s
4x 16-bit CH
LPDDR4 @ 1866MHz
29.9GB/s
Interconnect YES ARM CCI ARM CCI-550
Storage I/F  NO DOUBT* UFS 2.1 UFS 2.1
ISP/Camera SMILE* Dual 14-bit ISP Dual 14-bit ISP
(Improved)
Encode/Decode FAST* 2160p60 Decode
2160p30 Encode
2160p30 HEVC & H.264
Decode & Encode

2160p60 HEVC
Decode

Integrated Modem IF YOU INSIST* Kirin 970 Integrated LTE
(Category 18/13)

DL = 1200 Mbps
5x20MHz CA, 256-QAM

UL = 150 Mbps
2x20MHz CA, 64-QAM

Kirin 960 Integrated LTE
(Category 12/13)

DL = 600Mbps
4x20MHz CA, 64-QAM

UL = 150Mbps
2x20MHz CA, 64-QAM

Sensor Hub AFFIRMATIVE* i7 i6
NPU 8-BALL SAYS YES* Yes No
Mfc. Process ??? TSMC 10nm TSMC 16nm FFC
*May be subject to change

Huawei's keynote is today at 2pm CEST (8am ET), which will be live blogged if the data allows. It's going to be a lot of fun. Stay tuned.

Related Reading

Huawei To Announce Kirin 980 Today at IFA

In the smartphone wars, the chip inside powering the devices is becoming ever more important. Raw performance plus accelerators are pushing the boundaries of what we used to think was possible. Huawei’s unique selling point is that it designs its own chips for its smartphones, based a lot on Arm’s reference cores. Today, Huawei will be announcing its next generation SoC to the world.

As proudly declared on stage at the Honor launch event yesterday, with Honor’s own upcoming Magic 2 smartphone having it inside, Honor’s CEO George Zhao proudly declared that Richard Yu, CEO of Huawei CBG, will be announcing the Kirin 980 today.

Huawei’s current flagship SoC is the Kirin 970, which sits inside the Mate 10, P20, P20 Pro, and Honor’s Play, Honor 10, and Honor View 10. All of Huawei’s chips are made by their internal design house, HiSilicon, and the Kirin 970 was announced last year at IFA, so it makes sense that this year we would see the next generation, the Kirin 980, around this time.

Huawei has a long tradition of being a primary Arm partner, often using its latest design options where possible to get the edge of the competition. The Kirin 980, as with the silicon before it, aims for the highest echelons of performance in order to set it apart from the competition. You can also expect the Kirin 980 to be promoted alongside Huawei’s other ‘features’, such as GPU Turbo.

As for the internals of the Kirin 980, Huawei rarely disappoints on this front, but everyone will have to stay tuned for the official announcement to see just what's in store for their new SoC.

HiSilicon High-End Kirin SoC Lineup
SoC Kirin 980 Kirin 970 Kirin 960
CPU POWER* 4x A73 @ 2.36 GHz
4x A53 @ 1.84 GHz
4x A73 @ 2.36GHz
4x A53 @ 1.84GHz
GPU TURBO* ARM Mali-G72MP12
746 MHz
ARM Mali-G71MP8
1037MHz
LPDDR4
Memory
SOME* 4x 16-bit CH
LPDDR4 @ 1833 MHz
29.9GB/s
4x 16-bit CH
LPDDR4 @ 1866MHz
29.9GB/s
Interconnect YES ARM CCI ARM CCI-550
Storage I/F  NO DOUBT* UFS 2.1 UFS 2.1
ISP/Camera SMILE* Dual 14-bit ISP Dual 14-bit ISP
(Improved)
Encode/Decode FAST* 2160p60 Decode
2160p30 Encode
2160p30 HEVC & H.264
Decode & Encode

2160p60 HEVC
Decode

Integrated Modem IF YOU INSIST* Kirin 970 Integrated LTE
(Category 18/13)

DL = 1200 Mbps
5x20MHz CA, 256-QAM

UL = 150 Mbps
2x20MHz CA, 64-QAM

Kirin 960 Integrated LTE
(Category 12/13)

DL = 600Mbps
4x20MHz CA, 64-QAM

UL = 150Mbps
2x20MHz CA, 64-QAM

Sensor Hub AFFIRMATIVE* i7 i6
NPU 8-BALL SAYS YES* Yes No
Mfc. Process ??? TSMC 10nm TSMC 16nm FFC
*May be subject to change

Huawei's keynote is today at 2pm CEST (8am ET), which will be live blogged if the data allows. It's going to be a lot of fun. Stay tuned.

Related Reading

Huawei To Announce Kirin 980 Today at IFA

In the smartphone wars, the chip inside powering the devices is becoming ever more important. Raw performance plus accelerators are pushing the boundaries of what we used to think was possible. Huawei’s unique selling point is that it designs its own chips for its smartphones, based a lot on Arm’s reference cores. Today, Huawei will be announcing its next generation SoC to the world.

As proudly declared on stage at the Honor launch event yesterday, with Honor’s own upcoming Magic 2 smartphone having it inside, Honor’s CEO George Zhao proudly declared that Richard Yu, CEO of Huawei CBG, will be announcing the Kirin 980 today.

Huawei’s current flagship SoC is the Kirin 970, which sits inside the Mate 10, P20, P20 Pro, and Honor’s Play, Honor 10, and Honor View 10. All of Huawei’s chips are made by their internal design house, HiSilicon, and the Kirin 970 was announced last year at IFA, so it makes sense that this year we would see the next generation, the Kirin 980, around this time.

Huawei has a long tradition of being a primary Arm partner, often using its latest design options where possible to get the edge of the competition. The Kirin 980, as with the silicon before it, aims for the highest echelons of performance in order to set it apart from the competition. You can also expect the Kirin 980 to be promoted alongside Huawei’s other ‘features’, such as GPU Turbo.

As for the internals of the Kirin 980, Huawei rarely disappoints on this front, but everyone will have to stay tuned for the official announcement to see just what's in store for their new SoC.

HiSilicon High-End Kirin SoC Lineup
SoC Kirin 980 Kirin 970 Kirin 960
CPU POWER* 4x A73 @ 2.36 GHz
4x A53 @ 1.84 GHz
4x A73 @ 2.36GHz
4x A53 @ 1.84GHz
GPU TURBO* ARM Mali-G72MP12
746 MHz
ARM Mali-G71MP8
1037MHz
LPDDR4
Memory
SOME* 4x 16-bit CH
LPDDR4 @ 1833 MHz
29.9GB/s
4x 16-bit CH
LPDDR4 @ 1866MHz
29.9GB/s
Interconnect YES ARM CCI ARM CCI-550
Storage I/F  NO DOUBT* UFS 2.1 UFS 2.1
ISP/Camera SMILE* Dual 14-bit ISP Dual 14-bit ISP
(Improved)
Encode/Decode FAST* 2160p60 Decode
2160p30 Encode
2160p30 HEVC & H.264
Decode & Encode

2160p60 HEVC
Decode

Integrated Modem IF YOU INSIST* Kirin 970 Integrated LTE
(Category 18/13)

DL = 1200 Mbps
5x20MHz CA, 256-QAM

UL = 150 Mbps
2x20MHz CA, 64-QAM

Kirin 960 Integrated LTE
(Category 12/13)

DL = 600Mbps
4x20MHz CA, 64-QAM

UL = 150Mbps
2x20MHz CA, 64-QAM

Sensor Hub AFFIRMATIVE* i7 i6
NPU 8-BALL SAYS YES* Yes No
Mfc. Process ??? TSMC 10nm TSMC 16nm FFC
*May be subject to change

Huawei's keynote is today at 2pm CEST (8am ET), which will be live blogged if the data allows. It's going to be a lot of fun. Stay tuned.

Related Reading

Huawei To Announce Kirin 980 Today at IFA

In the smartphone wars, the chip inside powering the devices is becoming ever more important. Raw performance plus accelerators are pushing the boundaries of what we used to think was possible. Huawei’s unique selling point is that it designs its own chips for its smartphones, based a lot on Arm’s reference cores. Today, Huawei will be announcing its next generation SoC to the world.

As proudly declared on stage at the Honor launch event yesterday, with Honor’s own upcoming Magic 2 smartphone having it inside, Honor’s CEO George Zhao proudly declared that Richard Yu, CEO of Huawei CBG, will be announcing the Kirin 980 today.

Huawei’s current flagship SoC is the Kirin 970, which sits inside the Mate 10, P20, P20 Pro, and Honor’s Play, Honor 10, and Honor View 10. All of Huawei’s chips are made by their internal design house, HiSilicon, and the Kirin 970 was announced last year at IFA, so it makes sense that this year we would see the next generation, the Kirin 980, around this time.

Huawei has a long tradition of being a primary Arm partner, often using its latest design options where possible to get the edge of the competition. The Kirin 980, as with the silicon before it, aims for the highest echelons of performance in order to set it apart from the competition. You can also expect the Kirin 980 to be promoted alongside Huawei’s other ‘features’, such as GPU Turbo.

As for the internals of the Kirin 980, we’ve had a pre-briefing and can’t tell you much until the actual presentation. We went into a lot of detail with Huawei’s Benjamin Wang about the new chip design, and suffice to say that it follows in Huawei’s tradition to be a large number of ‘firsts’.

HiSilicon High-End Kirin SoC Lineup
SoC Kirin 980 Kirin 970 Kirin 960
CPU POWER* 4x A73 @ 2.36 GHz
4x A53 @ 1.84 GHz
4x A73 @ 2.36GHz
4x A53 @ 1.84GHz
GPU TURBO* ARM Mali-G72MP12
746 MHz
ARM Mali-G71MP8
1037MHz
LPDDR4
Memory
SOME* 4x 16-bit CH
LPDDR4 @ 1833 MHz
29.9GB/s
4x 16-bit CH
LPDDR4 @ 1866MHz
29.9GB/s
Interconnect YES ARM CCI ARM CCI-550
Storage I/F  NO DOUBT* UFS 2.1 UFS 2.1
ISP/Camera SMILE* Dual 14-bit ISP Dual 14-bit ISP
(Improved)
Encode/Decode FAST* 2160p60 Decode
2160p30 Encode
2160p30 HEVC & H.264
Decode & Encode

2160p60 HEVC
Decode

Integrated Modem IF YOU INSIST* Kirin 970 Integrated LTE
(Category 18/13)

DL = 1200 Mbps
5x20MHz CA, 256-QAM

UL = 150 Mbps
2x20MHz CA, 64-QAM

Kirin 960 Integrated LTE
(Category 12/13)

DL = 600Mbps
4x20MHz CA, 64-QAM

UL = 150Mbps
2x20MHz CA, 64-QAM

Sensor Hub AFFIRMATIVE* i7 i6
NPU 8-BALL SAYS YES* Yes No
Mfc. Process ??? TSMC 10nm TSMC 16nm FFC
*May be subject to change

Huawei's keynote is today at 2pm CEST (8am ET), which will be live blogged if the data allows. Our full Kirin 980 information reveal is half-an-hour later, at 2:30pm CEST. It's going to be a lot of fun. Stay tuned.

Related Reading

Huawei To Announce Kirin 980 Today at IFA

In the smartphone wars, the chip inside powering the devices is becoming ever more important. Raw performance plus accelerators are pushing the boundaries of what we used to think was possible. Huawei’s unique selling point is that it designs its own chips for its smartphones, based a lot on Arm’s reference cores. Today, Huawei will be announcing its next generation SoC to the world.

As proudly declared on stage at the Honor launch event yesterday, with Honor’s own upcoming Magic 2 smartphone having it inside, Honor’s CEO George Zhao proudly declared that Richard Yu, CEO of Huawei CBG, will be announcing the Kirin 980 today.

Huawei’s current flagship SoC is the Kirin 970, which sits inside the Mate 10, P20, P20 Pro, and Honor’s Play, Honor 10, and Honor View 10. All of Huawei’s chips are made by their internal design house, HiSilicon, and the Kirin 970 was announced last year at IFA, so it makes sense that this year we would see the next generation, the Kirin 980, around this time.

Huawei has a long tradition of being a primary Arm partner, often using its latest design options where possible to get the edge of the competition. The Kirin 980, as with the silicon before it, aims for the highest echelons of performance in order to set it apart from the competition. You can also expect the Kirin 980 to be promoted alongside Huawei’s other ‘features’, such as GPU Turbo.

As for the internals of the Kirin 980, Huawei rarely disappoints on this front, but everyone will have to stay tuned for the official announcement to see just what's in store for their new SoC.

HiSilicon High-End Kirin SoC Lineup
SoC Kirin 980 Kirin 970 Kirin 960
CPU POWER* 4x A73 @ 2.36 GHz
4x A53 @ 1.84 GHz
4x A73 @ 2.36GHz
4x A53 @ 1.84GHz
GPU TURBO* ARM Mali-G72MP12
746 MHz
ARM Mali-G71MP8
1037MHz
LPDDR4
Memory
SOME* 4x 16-bit CH
LPDDR4 @ 1833 MHz
29.9GB/s
4x 16-bit CH
LPDDR4 @ 1866MHz
29.9GB/s
Interconnect YES ARM CCI ARM CCI-550
Storage I/F  NO DOUBT* UFS 2.1 UFS 2.1
ISP/Camera SMILE* Dual 14-bit ISP Dual 14-bit ISP
(Improved)
Encode/Decode FAST* 2160p60 Decode
2160p30 Encode
2160p30 HEVC & H.264
Decode & Encode

2160p60 HEVC
Decode

Integrated Modem IF YOU INSIST* Kirin 970 Integrated LTE
(Category 18/13)

DL = 1200 Mbps
5x20MHz CA, 256-QAM

UL = 150 Mbps
2x20MHz CA, 64-QAM

Kirin 960 Integrated LTE
(Category 12/13)

DL = 600Mbps
4x20MHz CA, 64-QAM

UL = 150Mbps
2x20MHz CA, 64-QAM

Sensor Hub AFFIRMATIVE* i7 i6
NPU 8-BALL SAYS YES* Yes No
Mfc. Process ??? TSMC 10nm TSMC 16nm FFC
*May be subject to change

Huawei's keynote is today at 2pm CEST (8am ET), which will be live blogged if the data allows. It's going to be a lot of fun. Stay tuned.

Related Reading